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multiple oxide removal strategies
together in one system and supports interconnect pitches below
10 microns for heterogeneous
integration and silicon photonics.
It handles wafers, substrates and
310mm panels.
“As heterogeneous integration
evolves, overcoming interconnect
limitations becomes increasingly
important for maintaining our industry’s ambitious growth trajectory,”
said Joe Stockunas, president of
SEMI Americas. “We’re honored
to recognize Kulicke & Soffa for
its outstanding breakthrough in
fluxless TCB, a vital technology
that’s helping the industry meet the
rising demands of AI and high-performance computing.” He noted that
Kulicke & Soffa, a founding member
of SEMI, is celebrating its 75th anniversary this year.
“As features continue to shrink,
our fluxless TCB technology is
helping build the solid foundation
required for advancing the industry’s Heterogeneous Integration
Roadmap,” said Raj Talluri, president
and CEO of Kulicke & Soffa. “We
are proud to receive this recognition
from SEMI Americas, which reflects
the dedication and innovative spirit
of our entire team around the world.”
Established in 1979, the SEMI
Award is SEMI Americas’ highest
honor for contributions by semiconductor equipment and materials
suppliers. Commercially mature
winners must show commercial
success, and emerging technologies must show clear promise. The
2027 award will be presented at
SEMICON West in Phoenix, March
30–April 1, 2027.
Wafer Fab Equipment: A Booming Market
Built on a Fragmenting Supply Chain
Semiconductor equipment spending
is entering a new growth cycle
shaped by geopolitics, sovereignty
strategies and technology roadmaps.
According to Yole Group’s Status of
the Wafer Fab Equipment Industry
2026 report, wafer fab equipment
(WFE) revenue reached $129 billion
in 2025. It is forecast to approach
$220 billion by 2031, a 9% CAGR,
with cumulative sales exceeding
$1.2 trillion.
This growth comes despite uneven
end-market demand. Pressure on
chipmaker profitability remains,
with risks of overcapacity, fab redundancy and low utilization. Yet higher
equipment intensity across advanced
logic, DRAM/HBM, NAND and
advanced packaging continues to
fuel investment, supported by an
expanding installed base, recurring
service contracts and increasingly
complex fab automation requirements.
One market, three geographies
Figure 1. Wafer fab equipment vendor market share by type of
equipment, 2023. Source: Status of the Wafer Fab Equipment Industry
report, Yole Intelligence, 2024.
10 | Thursday, October 15
The WFE map looks very different
depending on whether revenue is
analyzed by headquarters, shipment
destination or manufacturing
location. Headquarters remain
concentrated around three poles. In
2025, North America-headquartered
vendors generated around 40%
of WFE revenue, led by Applied
Materials, Lam Research and KLA.
EMEA followed at around 28%,
dominated by ASML, with ASM
International,
Continued on page 12
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